Member

POSTECH BEVIL LAB

Professor

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Byungsub Kim

Department of Electrical Engineering, POSTECH

  • Education

    1. 2004-2010

      Massachusetts Institute of Technology (MIT), Cambridge, MA, USA, EECS (Ph.D.)

    2. 2002-2004

      Massachusetts Institute of Technology (MIT), Cambridge, MA, USA, EECS (M.S.)

    3. 1997-2000

      Pohang University of Science and Technology (POSTECH), Pohang, Korea, EE (B.S.)

  • Experience

    1. 2018 - present

      Director, Fundamental Research Laboratory of Ultra High-Speed Data Transmission for Real-Time High-Resolution In-Vivo Imaging

    2. 2022 - present

      Professor, Pohang University of Science and Technology (POSTECH), Korea

    3. 2016 - 2022

      Associate Professor, Pohang University of Science and Technology (POSTECH), Korea

    4. 2012 - 2016

      Assistant Professor, Pohang University of Science and Technology (POSTECH), Korea

    5. 2010 - 2011

      Analog Design Engineer, Intel Corporation, Hillsboro, OR, USA

  • Honors and Awards

    1. 2020

      Electronics and Telecommunications Research Institute Award, 21th Korean Solid-State Circuit Design Contest

    2. 2019

      POSTECH-Samsumg Electronics Industry-Academia Cooperative Research Center Best Paper Award

    3. 2018

      Silver Award, 19th Korean Solid-State Circuit Design Contest

    4. 2017

      Gold Award, 15th Korean Solid-State Circuit Design Contest

    5. 2014

      Gold Award, 15th Korean Solid-State Circuit Design Contest

    6. 2011

      Jin-Au Kong Outstanding Doctoral Thesis Honorable Mention, Department of Electrical Engineering and Computer Science, MIT

    7. 2011

      2009 Best Paper Award, IEEE Journal of Solid-State Circuits

    8. 2009

      2009 Beatrice Winner Award for Editorial Excellence, IEEE International Solid-State Circuits Conference (ISSCC)

  • Academic Activities

    1. 2018 - present

      Technical Program Committee (TPC) Member, IEEE International Solid-State Circuits Conference (ISSCC)

    2. 2012 - 2018

      Technical Program Committee (TPC) Member, IEEE Asian Solid-State Circuits Conference (ASSCC)

    3. 2012,2013, 2015

      Session Co-chair, IEEE Asian Solid-State Circuits Conference (ASSCC)

    4. 2013 - 2014

      Student Design Contest Committee Member, IEEE Asian Solid-State Circuits Conference (ASSCC)

    5. 2014 - present

      Technical Program Committee (TPC) Member, IEEE International Symposium on VLSI Design, Automation & Test

  • Research Interests

    1. High-Speed Links


    2. Design Automation for Analog Circuits