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POSTECH BEVIL LAB
Selected Journals
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Selected Journals 카테고리
전체
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Total 33건
1 페이지
2024
33
"A CNN-Based Technique to Assist Layout-to-Generator Conversion for Analog Circuits"
Sungyu Jeong ,Minsu Kim,Byungsub Kim,
TechRxiv,
2024
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LINK
32
"Compact Single-ended Transceivers Demonstrating Flexible Generation of 1/N-rate Receiver Front-ends for Short-Reach Links"
Myungguk Lee, Jaeik Cho, Junung Choi, Won Joon Choi, Jiyun Lee, Iksu Jang, Changjae Moon, Gain Kim, and Byungsub Kim,
IEEE Transactions on Circuits and Systems I : Regular Papers,
2024
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LINK
2023
31
"A Layout-to-Generator Conversion Framework With Graphical User Interface for Visual Programming of Analog Layout Generators"
Sungyu Jeong, Chanhyong Lee, Minsu Kim, Iksu Jang, Myungguk Lee, Junung Choi, Byungsub Kim,
TechRxiv,
2023
LINK
30
"A 20-Gb/s/Pin Compact Single-Ended DCC-Less DECS Transceiver With CDR-Less RX Front-End for On-Chip Links"
Jaeyoung Seo; Sooeun Lee; Myungguk Lee; Changjae Moon; Byungsub Kim,
IEEE Journal of Solid-State Circuits,
2023
LINK
29
"A Speculative Divide-and-Conquer Optimization Method for Large Analog/Mixed-Signal Circuits: A High-Speed FFE SST Transmitter Example"
Kwangmin Kim, Hyoseok Song, Byeongcheol Lee and Byungsub Kim,
IEEE Transactions on Very Large Scale Integration (VLSI) Systems,
2023
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2022
28
"A 6Gb/s Transceiver Design with Phase-Difference Modulation Signaling for Multi-drop DRAM Interface"
Chang Yoon Han, Jae Young Seo, Byung Sub Kim,
Journal of Integrated Circuits and Systems,
2022
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LINK
27
"A Reflection Self-Canceling Design Technique for Multidrop Memory Interfaces"
Changyoon Han, Jaeyoung Seo, Byungsub Kim,
IEEE Transactions on Components, Packaging and Manufacturing Technology (TCPMT),
2022
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26
"A Compact Single-Ended Inverter-based Transceiver with Swing Improvement for Short-Reach Links"
Myungguk Lee, Puneet Kanwar Kaur, Jaeyoung Seo, Seungho Han, and Byungsub Kim,
IEEE Transactions on Circuits and Systems I: Regular Papers,
2022
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2021
25
"A DFE-Enhanced Phase-Difference Modulation Signaling for Multi-Drop Memory Interfaces"
Sooeun Lee, Jaeyoung Seo, Changyoon Han, Jae-Yoon Sim, Hong-June Park and Byungsub Kim,
IEEE Transactions on Circuits and Systems II: Express Briefs,
2021
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2020
24
"A 7.8 Gb/s 2.9 pJ/b Single-Ended Receiver With 20 tap DFE for Highly-Reflective Channels"
Jaeyoung Seo, Jaehyun Ko, Kyunghyun Lim, Sooeun Lee, Jae-Yoon Sim, Hong-June Park and Byungsub Kim,
IEEE Transactions on Very Large Scale Integration (VLSI) Systems,
2020
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23
"A 7.8 Gb/s/pin, 1.96 pJ/b Transceiver with Phase-Difference-Modulation Signaling for highly-Reflective Interconnects"
Sooeun Lee, Jaeyoung Seo, Kyunghyun Lim, Jaehyun Ko, Jae-Yoon Sim, Hong-June Park and Byungsub Kim,
IEEE Transactions on Circuits and Systems I (TCAS-I),
2020
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LINK
22
"A Body Channel Communication Technique Utilising Decision Feedback Equalisation"
Ji-Hoon Lee, Jaehyun Ko, Kwangmin Kim, Minsoo Choi, Jae-Yoon Sim, Hong-June Park and Byungsub Kim,
IEEE Access,
2020
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2019
21
"A Code Inversion Encoding Technique to Improve Read Margin of A Cross-Point Phase Change Memory"
Kwangmin Kim, Seokjoon Kang and Byungsub Kim,
IEEE Transactions on Very Large Scale Integration (VLSI) Systems,
2019
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LINK
20
"Impact of Line Mismatch on Two-Wire De-Embedding Methods in Early Characterization of Emerging Interconnects"
Minsoo Choi, Taehee Kim, Kyunghyun Lim and Byungsub Kim,
IEEE Transactions on Components, Packaging and Manufacturing Technology,
2019
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LINK
19
"A Simple Low-Cost Electric-Contact-Assisted Alignment Method for Die-Stacking On an Interposer or a Printed_Circuit-Board"
Taehee Kim, Myungguk Lee, Sangwon Baek, Junyoung Lee, Bo Jin and Byungsub Kim,
IEEE Transactions on Components, Packaging and Manufacturing Technology,
2019
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LINK
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