Automatic ReRAM SPICE Model Generation From Empirical Data for Fast ReRAM-Circuit Coevaluation
- Journal
- IEEE Transactions on Very Large Scale Integration Systems
- Vol
- vol. 25, no. 6
- Page
- pp. 1821 - 1830
- Year
- 2017
- File
- Automatic_ReRAM_SPICE_Model_Generation_From_Empirical_Data_for_Fast_ReRAM-Circuit_Coevaluation.pdf (3.3M) 21회 다운로드 DATE : 2022-04-30 00:01:40
- Link
- https://ieeexplore.ieee.org/document/7840076 499회 연결
POSTECH-Samsung Electronics ReRAM Cluster Research Project, National Research Foundation of Korea through the Korean Government (MSIP) under Grant 2015R1A2A2A09001553.