"A Code Inversion Encoding Technique to Improve Read Margin of A Cross-Point Phase Change Memory" Kwangmin Kim, Seokjoon Kang and Byungsub Kim,

IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 2019

"Impact of Line Mismatch on Two-Wire De-Embedding Methods in Early Characterization of Emerging Interconnects" Minsoo Choi, Taehee Kim, Kyunghyun Lim and Byungsub Kim,

IEEE Transactions on Components, Packaging and Manufacturing Technology, 2019

"A Simple Low-Cost Electric-Contact-Assisted Alignment Method for Die-Stacking On an Interposer or a Printed_Circuit-Board" Taehee Kim, Myungguk Lee, Sangwon Baek, Junyoung Lee, Bo Jin and Byungsub Kim,

IEEE Transactions on Components, Packaging and Manufacturing Technology, 2019