A Simple Low-Cost Electric-Contact-Assisted Alignment Method for Die-Stacking On an Interposer or a Printed_Circuit-Board

Journal

IEEE Transactions on Components, Packaging and Manufacturing Technology

Vol

vol. 9, no. 2

Page

pp. 367 - 374

Author

Taehee Kim, Myungguk Lee, Sangwon Baek, Junyoung Lee, Bo Jin and Byungsub Kim

Year

2019

Date

Feb

File

A_Simple_Low-Cost_Electric-Contact-Assisted_Alignment_Method_for_Die_Stacking_on_an_Interposer_or_a_Printed_Circuit_Board.pdf (2.5M) 16회 다운로드 DATE : 2022-04-30 01:29:00

Link

https://ieeexplore.ieee.org/document/8543855 307회 연결