Impact of Line Mismatch on Two-Wire De-Embedding Methods in Early Characterization of Emerging Interconnects
- Journal
- IEEE Transactions on Components, Packaging and Manufacturing Technology
- Vol
- vol. 9, no. 5
- Page
- pp. 905 - 912
- Year
- 2019
- File
- Impact_of_Line_Mismatch_on_Two-Wire_Deembedding_Methods_in_Early_Characterization_of_Emerging_Interconnects.pdf (1.6M) 11회 다운로드 DATE : 2022-04-30 01:26:28
- Link
- https://ieeexplore.ieee.org/document/8395151 273회 연결
National Research Foundation of Korea under Grant 2018R1A2A2A16022248,
Ministry of Science and ICT of South Korea through the ICT Consilience Creative Program supervised by the Institute for Information and Communications Technology Promotion under Grant IITP-2018-2011-1-00783.